电子元器件烧结石墨治具
电子元器件烧结模具用石墨，在完结地图规划并经工艺厂家流片后，能够选用两种办法对芯片进行功能、功能测验：一种办法是直接键合到笔颁叠（印制电路板）上，另一种办法是经过封装厂家进行封装后，再焊接至体系中。而封装办法又可分为软封装与硬封装，软封装首要依据运用要求直接制作成模块，而硬封装则是封装成独立的芯片。
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